Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/17/2001
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Application #:
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09492819
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Filing Dt:
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01/28/2000
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Inventors:
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Kyujin Jung, Kun-A Kang
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Title:
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Low-pin-count chip package and manufacturing method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 26, CHIN 3RD. ROAD |
NANTZE EXPORT PROCESSING ZONE, TAIWAN R.O.C |
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LOWE HAUPTMAN GOPSTEIN GILMAN & BERNER |
BENJAMIN J. HAUPTMAN |
1700 DIAGONAL ROAD, SUITE 310 |
ALEXANDRIA, VA 22314 |
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