Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/17/2001
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Application #:
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09497669
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Filing Dt:
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02/04/2000
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Inventor:
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Tzung-Han Lee
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Title:
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Method of forming a self-aligned contact hole on a semiconductor wafer
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE DATE(S) OF EXECUTION INDICATED IN THE COVER SHEET PREVIOUSLY RECORDED ON REEL 010553 FRAME 0335. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST.
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| NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN ROAD 2 |
| HSIN-CHU, TAIWAN R.O.C |
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| WINSTON HSU |
| 3F, NO. 52, LANE 46, MIN-SHEN RD. |
| YUNG-HO CITY, TAIPEI HSIEN |
| TAIWAN, R.O.C. |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE ROAD, SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| AISAWA TECHNOLOGIES, LLC |
| 2711 CENTERVILLE ROAD, SUITE 400 |
| WILMINGTON, DE 19808 |
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