Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/17/2001
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Application #:
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09514846
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Filing Dt:
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02/28/2000
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Inventor:
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Bily Wang
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Title:
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Folded heat sink for semiconductor device package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 18, LANE 522, SEC. 5 CHUNG HUA ROAD |
HSIN-CHU, TAIWAN ROC |
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HUNG CHANG LIN |
8 SCHINDLER COURT |
SILVER SPRING, MD 20903 |
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