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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6271585
Issue Dt:
08/07/2001
Application #:
09110669
Filing Dt:
07/07/1998
Inventors:
MITSUO OSADA, AKIRA ICHIDA, NORIO HIRAYAMA, KIYOSHI ASIA, HIDETOSHI MAESATO et al
Title:
HEAT SINK SUBSTRATE CONSISTING ESSENTIALLY OF COOPER AND MOLYBDENUM AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
009327/0851Recorded: 07/07/1998Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
OSADA, MITSUO
Exec Dt:
06/29/1998
ICHIDA, AKIRA
Exec Dt:
06/29/1998
HIRAYAMA, NORIO
Exec Dt:
06/29/1998
ASAI, KIYOSHI
Exec Dt:
06/29/1998
MAESATO, HIDETOSHI
Exec Dt:
06/29/1998
ARIKAWA, TADASHI
Exec Dt:
06/29/1998
Assignee:
TOKYO TUNGSTEN CO. LTD.
24-8, HIGASHIUENO 5-CHOME
TAITO-KU, TOKYO, JAPAN
Correspondent:
SUGHRUE, MION, ZINN, MACPEAK & SEAS PLLC
J. FRANK OSHA, ESQ.
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, D.C. 20037-3202
Assignment: 2
Reel/Frame:
030314/0498Recorded: 04/30/2013Pages: 30
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
TOKYO TUNGSTEN CO., LTD.
Exec Dt:
10/02/2000
Assignee:
A.L.M.T. CORP.
1-11-11, SHIBA
MINATO-KU, TOKYO, JAPAN
Correspondent:
FREDERICK J. DORCHAK
1077 NORTHERN BOULEVARD
ROSLYN, NY 11576

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