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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/28/2001
Application #:
09450545
Filing Dt:
11/30/1999
Inventors:
CHUNG W. HO, TSING-CHOW WANG
Title:
PROCESS TO MAKE A TALL SOLDER BALL BY PLACING A EUTECTIC SOLDER BALL ON TOP OF A HIGH LEAD SOLDER BALL
Assignment: 1
Reel/Frame:
010428/0630Recorded: 11/30/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/25/1999
Exec Dt:
10/25/1999
Assignee:
SCIENCE-BASED INDUSTRIAL PARK
NO. 121 PARK AVENUE 3
HSIN-CHU, TAIWAN ROC
Correspondent:
TUNG & ASSOCIATES
RANDY W. TUNG
838 W. LONG LAKE ROAD
SUITE 120
BLOOMFIELD HILLS, MI 48302

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