Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09556213
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Filing Dt:
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04/21/2000
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Inventor:
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Peter R. Ewer
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Title:
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CHIP SCALE PACKAGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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233 KANSAS STREET |
EL SEGUNDO, CALIFORNIA 90245 |
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OSTROLENK, FABER, GERB ET AL. |
SAMUEL H. WELNER |
1180 AVENUE OF THE AMERICAS |
NEW YORK, NY 10036-8403 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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7002-D LITTLE RIVER TPKE |
ANNANDALE, VIRGINIA 22003 |
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SEONG-JUN PARK |
8133 LEESBURG PIKE STE310 |
VIENNA, VA 22182 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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10TH FLOOR, GOLDEN TOWER |
511, SAMSUNG-RO, GANGNAM-GU |
SEOUL, KOREA, REPUBLIC OF 135-090 |
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HC PARK & ASSOCIATES, PLC |
1894 PRESTON WHITE DR. |
RESTON, VA 20191 |
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