Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09638989
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Filing Dt:
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08/15/2000
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Inventors:
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Randy H. Y. Lo, Chi-CHuan Wu, Han-Ping Pu, Eric Ko
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Title:
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Multi-chip module package structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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DA FONG ROAD |
NO. 123, SEC. 3 |
TANTZU, TAICHUNG, TAIWAN ROC |
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EDWARDS & ANGELL, LLP |
PETER F. CORLESS |
130 WATER STREET |
BOSTON, MA 02109 |
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