Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09545996
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Filing Dt:
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04/10/2000
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Inventors:
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Randy H.Y. Lo, Jeng Yuan Lai, Eric Ko, Tzong-Da Ho
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Title:
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Ball-grid array integrated circuit package with an unembedded type of heat-dissipation structure and method of manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TANTZU |
| NO. 123, SEC. 3, DA FONG ROAD |
| TAICHUNG, TAIWAN R.O.C |
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| PETER F. CORLESS, ESQ. |
| 130 WATER STREET |
| BOSTON, MA 02109 |
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Assignment:
2
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RE-RECORD TO CORRECT THE FOURTH ASSIGNOR ON REEL 010708 FRAME 0650. ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST.
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| TANTZU |
| NO. 123, SEC.3, DA FONG ROAD |
| TAICHUNG, TAIWAN R.O.C |
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| DIKE, BRONSTEIN, ROBERTS ET AL |
| PETER F. CORLESS |
| 130 WATER STREET |
| BOSTON, MA 02109T |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD |
| TANTZU TAICHUNG, TAIWAN R.O.C |
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| DIKE, BRONSTEIN, ROBERTS & CUSHMAN |
| PETER F. CORLESS |
| INTELLECTUAL PROPERTY GROUP OF ET AL |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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