Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09561057
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Filing Dt:
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04/28/2000
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Inventors:
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Randy H. Y. Lo, Chi Chuan Wu
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Title:
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Intergration of heat conducting apparatus and chip carrier in IC package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG RD |
| TANTZU TAICHUNG, TAIWAN R.O.C |
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| KLARQUIST, SPARKMAN, CAMPBELL, ET AL. |
| MARK L. BECKER |
| ONE WORLD TRADE CENTER |
| 121 S.W. SALMON STREET, SUITE 1600 |
| PORTLAND, OR 97204-2988 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG RD. |
| TANTZU TAICHUNG, TAIWAN R.O.C |
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| KLARQUIST SPARKMAN CAMPBELL ET AL |
| MARK L. BECKER |
| ONE WORLD TRADE CENTER, SUITE 1600 |
| 121 S.W. SALMON STREET |
| PORTLAND, OR 97204-2988 |
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