Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/04/2001
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Application #:
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09515849
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Filing Dt:
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02/29/2000
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Inventors:
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Toshimitsu Tachibana, Kenji Sato, Mitsuo Iimura
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Title:
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Method of resin-encapsulating semiconductor chip and mold-releasing film used for the method
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Assignment:
1
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INVALID RECORDING, SEE CORRECTIVE RECORDING AT REEL 010804, FRAME 0379 (DOCUMENT RE-RECORDED TO CORRECT RECORDATION DATE).
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1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI |
OSAKA, JAPAN |
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SUGHRUE, MION, ZINN, MACPEAK & SEAS |
MARK BOLAND |
2100 PENNSYLVANIA AVENUE, N.W. |
SUITE 800 |
WASHINGTON, D.C. 20037-3202 |
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Assignment:
2
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(ASSIGNMENT OF ASSIGNOR'S INTEREST) RE-RECORD TO CORRECT THE RECORDATION DATE OF 2/9/00 TO 2/29/00 PREVIOUSLY RECORDED AT REEL 10657 FRAME 0377
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1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI |
OSAKA, JAPAN |
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SUGHRUE, MION ET AL |
MARK BOLAND |
2100 PENNSYLVANIA AVENUE, N.W. |
SUITE 800 |
WASHINGTON, D.C. 20037-3202 |
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