Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/09/2001
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Application #:
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09806262
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Filing Dt:
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03/28/2001
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Inventors:
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Takahisa Arima, Yukihisa Kusuda
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Title:
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Method of dicing semiconductor wafer into chips, and structure of groove formed in dicing area
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-11, DOSHO-MACHI 3-CHOME CHUO-KU, OSAKA-SHI |
| OSAKA, JAPAN 541-0 |
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| RATNER & PRESTIA |
| KENNETH N. NIGON |
| SUITE 301, ONE WESTLAKES, BERWYN |
| P.O. BOX 980 |
| VALLEY FORGE, PA 19482-0980 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-3, AKASAKA 9-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| DAVID J. CUSHING - SUGHRUE MION PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, D.C, DC 20037 |
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