Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/27/2001
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Application #:
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09110986
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Filing Dt:
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07/07/1998
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Inventors:
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CHEN-DER HUANG, HSING-HAI CHEN
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Title:
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STRUCTURE FOR MANUFACTURING A SEMICONDUCTOR DIE WITH COPPER PLATED TAPES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| 123, PARK AVE-3RD |
| HSINCHU, TAIWAN R.O.C |
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| CHRISTENSEN O'CONNOR, ET AL. |
| CHUN M. NG, ESQ. |
| 1420 FIFTH AVENUE |
| SUITE 2800 |
| SEATTLE, WA 98101-2347 |
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