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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/11/2001
Application #:
08908794
Filing Dt:
08/08/1997
Inventors:
NGUYEN DUC BUI, MICHAEL A. NIEDERHOFER, VAN HUNG PHAM
Title:
METHOD AND APPARATUS FOR RELIABILITY TESTING OF INTEGRATED CIRCUIT STRUCTURES AND DEVICES
Assignment: 1
Reel/Frame:
008735/0322Recorded: 08/08/1997Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/05/1997
Exec Dt:
08/07/1997
Exec Dt:
08/07/1997
Assignee:
P.O. BOX 3453
ONE AMD PLACE
SUNNYVALE, CALIFORNIA 94088
Correspondent:
OPPENHEIMER POMS SMITH
CLAUDE A. S. HAMRICK
TEN ALMADEN BLVD., STE. 600
SAN JOSE, CA 95113

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