Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/25/2001
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Application #:
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09522944
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Filing Dt:
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03/10/2000
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Inventors:
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Sung-Man Hwang, Hyung-Moo Park
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Title:
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Method for fabricating semiconductor device without having grooves at edge portions of STI
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416 MAETAN-DONG, PALDAL-GU |
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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KILE, MCINTYRE, HARBIN & LEE |
EUGENE M. LEE |
1101 PENNSYLVANIA AVENUE, N.W. SUITE 800 |
WASHINGTON D.C 20004 |
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