Patent Assignment Abstract of Title
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For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/08/2002
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Application #:
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09406916
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Filing Dt:
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09/24/1999
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Inventors:
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SANG-GEUN KIM, SEUNG-CHUL AHN
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Title:
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DIE BONDING EQUIPMENT AND METHOD FOR MANUFACTURING FINE PITCH BALL GRID ARRAY PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, PALDAL-GU, SUWON-CITY |
| KYONGGI-DO, KOREA, REPUBLIC OF |
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| SKJERVEN, MORRILL, MACPHERSON ET AL. |
| DAVID T. MILLERS |
| 25 METRO DRIVE, SUITE 700 |
| SAN JOSE, CA 95110 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| NIH DIVISION OF EXTRAMURAL INVENTIONS AND TECHNOLOGY RESOURCES (DEITR) |
| 6705 ROCKLEDGE DRIVE, SUITE 310, MSC 7980 |
| BETHESDA, MARYLAND 20892-7980 |
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| DIRECTOR, DEITR |
| NIH, 6705 ROCKLEDGE DRIVE, SUITE 310 |
| MSC 7980 |
| BETHESDA, MD 20892-7980 |
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