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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/05/2002
Application #:
09666652
Filing Dt:
09/20/2000
Inventors:
Tae Seung Lee, Kie Youn Jeong, Byung Yun Lim, Min Jae Hwang
Title:
Thermoplastic resin composition
Assignment: 1
Reel/Frame:
011133/0511Recorded: 09/20/2000Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/21/2000
Exec Dt:
08/21/2000
Exec Dt:
07/12/2000
Exec Dt:
07/12/2000
Assignee:
JONGRO-KU
140-2, KE-DONG
SEOUL, KOREA, REPUBLIC OF 110-7
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH LLP
JOSEPH A. KOLASCH
P.O. BOX 747
FALLS CHURCH, VA 22040-0747
Assignment: 2
Reel/Frame:
011452/0030Recorded: 01/18/2001Pages: 6
Conveyance:
CORRECTION OF SECOND ASSIGNEE TO CORRESPOND TO THE EXECUTED ASSIGNMENT, PREVIOUSLY RECORDED AT REEL 011133, FRAME 0511.
Assignors:
Exec Dt:
08/21/2000
Exec Dt:
08/21/2000
Exec Dt:
07/12/2000
Exec Dt:
07/12/2000
Assignees:
140-2 KE-DONG, JONGRO-KU
SEOUL, KOREA, REPUBLIC OF 110-7
SHINDAEBANG-DONG, DONGJAK-KU
395-67 LOTTE KWANAK TOWER BUILDING
SEOUL, KOREA, REPUBLIC OF
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
JOSEPH A. KOLASCH
P.O. BOX 747
FALLS CHURCH, VA 22040-0747

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