Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/12/2002
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Application #:
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09488521
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Filing Dt:
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01/21/2000
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Inventors:
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Sung Gyu Pyo, Heon Do Kim
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Title:
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Method Of Forming A Copper Wiring In A Semiconductor Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ICHON-SHI, |
| SAN 136-1, AMI-RI, BUBAL-UEP |
| KYUNGKI-DO, KOREA, REPUBLIC OF |
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| PENNIE & EDMONDS, LLP |
| HARRY C. JONES, III |
| 1667 K. STREET, N.W. |
| WASHINGTON, DC 20006 |
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