Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/19/2002
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Application #:
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09709908
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Filing Dt:
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11/10/2000
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Inventors:
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Chih-Shun Chen, Chao-Dung Suo, Jui-Meng Jao, Ke-Chuan Yang, Feng-Lung Chien
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Title:
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Method of fabricating solder bumps with high coplanarity for flip-chip application
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD TANTZU |
| TAICHUNG, TAIWAN R.O.C |
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| DIKE, BRONSTEIN, ROBERTS & CUSHMAN |
| ATTN: PETER F. CORLESS |
| 130 WATER STREET |
| BOSTON, MA 02109 |
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