Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/26/2002
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Application #:
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09699888
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Filing Dt:
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10/30/2000
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Inventors:
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Han-Ping Pu, Chien-Ping Huang
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Title:
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Method of bonding ball grid array package to circuit board without causing package collapse
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TANTZU |
| NO. 123, SEC. 3, DA FONG ROAD |
| TAICHUNG, TAIWAN R.O.C |
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| EDWARDSS & ANGELL, LLP |
| PETER F. CORLESS |
| DIKE, BRONSTEIN, ROBERTS & CUSHMAN, ETAL |
| 130 WATER STREET |
| BOSTON, MA 02109 |
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