USPTO Assignments on the Web

	United States Patent and Trademark Office
	Home\|Site Index\|Search\|Guides\|Contacts\|eBusiness\|eBiz alerts\|News\|Help

Assignments on the Web > Patent Query

Patent Assignment Abstract of Title

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1

Patent #:	6358834	Issue Dt:	03/19/2002	Application #:	09688123	Filing Dt:	10/16/2000
Inventors:	Wen Lo Shieh, Fu Yu Huang, Yung-Cheng Chuang, Hsuan Jui Chang, Hui-Pin Chen, Ning Huang et al
Title:	Method of forming bumps on wafers or substrates

Assignment: 1

Reel/Frame:

011250/0001

Recorded: 10/16/2000

Pages: 8

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

SHIEH, WEN LO

Exec Dt:

08/31/2000

HUANG, FU YU

Exec Dt:

08/31/2000

CHUANG, YUNG-CHENG

Exec Dt:

08/31/2000

HU, CHIA-CHIEH

Exec Dt:

08/31/2000

CHEN, HUI-PIN

Exec Dt:

08/31/2000

HUANG, NING

Exec Dt:

08/31/2000

TU, FENG CHANG

Exec Dt:

08/31/2000

CHANG, CHUNG MING

Exec Dt:

08/31/2000

CHIANG, HUA WEN

Exec Dt:

08/31/2000

CHAN, HSUAN JUI

Exec Dt:

08/31/2000

Assignee:

ORIENT SEMICONDUCTOR ELECTRONICS LIMITED

N.E.P.Z.

12-2 NEI HUAN SOUTH ROAD

KAOHSIUNG, TAIWAN

Correspondent:

WEN LO SHIEH

PO BOX 82-144

TAIPEI, TAIWAN

Search Results as of: 05/28/2024 05:06 AM

If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6

Web interface last modified: August 25, 2017 v.2.6