Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/19/2002
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Application #:
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09728685
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Filing Dt:
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11/30/2000
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Inventor:
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Sergey Lopatin
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Title:
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Method of reducing electromigration in copper lines by forming an interim layer of calcium-doped copper seed layer in a chemical solution and semiconductor device thereby formed
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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F0908 |
ONE AMD PLACE, M/S 68 |
SUNNYVALE, CALIFORNIA 94088 |
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LARIVIERE, GRUBMAN & PAYNE, LLP |
MAY LIN DEHAAN |
P.O. BOX 3140 |
P1238 |
MONTEREY, CA 93940 |
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