Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/19/2002
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Application #:
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09489167
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Filing Dt:
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01/21/2000
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Inventors:
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Chien Ping Huang, Kevin Chiang, Tzong Da Ho
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Title:
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Ball grid array integrated circuit package structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG ROAD TANTZU |
TAICHUNG, TAIWAN R.O.C |
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DIKE, BRONSTEIN, ROBERTS & CUSHMAN |
ATTN: PETER F. CORLESS, ESQ. |
130 WATER STREET |
BOSTON, MA 02109 |
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