Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/19/2002
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Application #:
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09730311
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Filing Dt:
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12/05/2000
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Inventors:
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Pao-Ho Yuan, Ting-Ke Chai, Lien-Chi Chan, Jen-Yi Tsai
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Title:
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Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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TANTZU |
NO. 123, SEC. 3, DA FONG ROAD |
TAICHUNG, TAIWAN R.O.C |
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EDWARDS & ANGELL LLP |
PETER F. CORLESS |
130 WATER STREET |
BOSTON, MASSACHUSETTS 02109-4280 |
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