Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/16/2002
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Application #:
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09513483
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Filing Dt:
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02/25/2000
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Inventors:
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Richard F. Hill, Forest Hampton III
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Title:
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Multi-Layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3256 WEST 25TH STREET |
CLEVELAND, OHIO 44109 |
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WYATT, GERBER, MELLER AND O'ROURKE |
EUGENE LIEBERSTEIN |
P.O. BOX 2198 |
GRAND CENTRAL STATION |
NEW YORK, NY 10163 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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3481 RIDER TRAIL SOUTH |
EARTH CITY, MISSOURI 63045 |
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HUSCH BLACKWELL LLP |
190 CARONDELET PLAZA |
SUITE 600 |
ST. LOUIS, MO 63105 |
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