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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/23/2002
Application #:
09514424
Filing Dt:
02/28/2000
Inventor:
Kelvin Chau
Title:
Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs
Assignment: 1
Reel/Frame:
011040/0396Recorded: 09/01/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/18/2000
Assignee:
4138 LAKESIDE DRIVE
RICHMOND, CALIFORNIA 94801
Correspondent:
LUMEN
JOSHAU D. ISENBERG
426 LOWELL AVENUE
PALO ALTO, CA 94301
Assignment: 2
Reel/Frame:
015552/0472Recorded: 07/12/2004Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/19/2004
Assignee:
ONE TECHNOLOGY WAY
CORPORATE HEADQUARTERS
NORWOOD, MASSACHUSETTS 02062-9106
Correspondent:
JDI PATENT
JOSHUA D. ISENBERG
204 CASTRO LANE
FREMONT, CA 94539

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