Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2002
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Application #:
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09522047
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Filing Dt:
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03/09/2000
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Inventor:
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HIROSHI OKAMURA
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Title:
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METHOD FOR MANUFACTURING MULTILAYER INTERCONNECTS BY FORMING A TRENCH WITH AN UNDERLYING THROUGH-HOLE IN A LOW DIELECTRIC CONSTANT INSULATOR LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1 NISHISHINJUKU 2-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN |
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| EPSON RESEARCH DEVELOPMENT INC. |
| MARK P. WATSON |
| INTELLECTUAL PROPERTY DEPARTMENT |
| 150 RIVER OAKS PARKWAY, SUITE 225 |
| SAN JOSE, CA 95134 |
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