Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/07/2002
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Application #:
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09619536
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Filing Dt:
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07/19/2000
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Inventors:
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Eisuke Wadahara, Kenichi Yoshioka, Soichi Ishibashi
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Title:
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THERMOPLASTIC RESIN COMPOSITION, MOLDING MATERIAL, AND MOLDED ARTICLE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-1, NIHONBASHI-MUROMACHI 2-CHOME |
CHUO-KU, TOKYO 103-8666, JAPAN |
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MORRISON & FOERSTER, LLP |
BARRY E. BRETSCHNEIDER |
2000 PENNSYLVANIA AVENUE, N.W. |
WASHINGTON, DC 20006-1888 |
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