Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/14/2002
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Application #:
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09847278
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Filing Dt:
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05/03/2001
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Inventors:
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Chi Wah Cheng, Ping Chun Benson Chong, Hoi Shuen Joseph Tang, Ka On Alfred Yue et al
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Title:
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SOLDER REFLOW OVEN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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16 KUNG YIP STREET |
4/F WATSON CENTRE |
KWAI CHUNG, HONG KONG |
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BURNS, DOANE, SWECKER & MATHIS LLP |
JAMES A. LABARRE |
P.O. BOX 1404 |
ALEXANDRIA, VA 22313-1404 |
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