Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/14/2002
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Application #:
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09668293
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Filing Dt:
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09/25/2000
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Inventor:
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Fumihiro Umika
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Title:
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Epoxy resin composition and semiconductor device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHISHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN |
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| SMITH, GAMBRELL & RUSSELL, LLP |
| ROBERT G. WEILACHER |
| 1850 M STREET, N.W., SUITE 800 |
| INTELLECTUAL PROPERTY GROUP |
| WASHINGTON, D.C. 20036 |
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