Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/14/2002
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Application #:
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09854112
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Filing Dt:
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05/11/2001
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Inventor:
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Tung-Liang Shao
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Title:
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WAFER-LEVEL PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3, LI-HSIN RD. V |
| HSINCHU, TAIWAN R.O.C |
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| J.C. PATENTS, INC. |
| JIAWEI HUANG |
| 1340 REYNOLDS AVENUE, SUITE 114 |
| IRVINE, CALIFORNIA 92614 |
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