Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/14/2002
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Application #:
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08878143
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Filing Dt:
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06/18/1997
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Publication #:
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Pub Dt:
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10/25/2001
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Inventors:
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PEIJUN DING, TONY CHIANG, IMRAN HASHIM, BINGIX SUN, BARRY CHIN
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Title:
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COPPER ALLOY SEED LAYER FOR COPPER METALLIZATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2880 SCOTT BLVD. PO BOX 450A |
SANTA CLARA, CALIFORNIA 95052 |
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APPLIED MATERIALS, INC. |
CHARLELS S. GUENZER |
2880 SCOTT BLVD. |
P.O. BOX 450A |
SANTA CLARA, CA 95052 |
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