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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	6390356	Issue Dt:	05/21/2002	Application #:	09693951	Filing Dt:	10/23/2000
Inventors:	Wen Lo Shieh, Fu Yu Huang, Yung-Cheng Chuang, Chia-Chieh Hu, Hui-Pin Chen et al
Title:	METHOD OF FORMING CYLINDRICAL BUMPS ON A SUBSTRATE FOR INTEGRATED CIRCUITS

Assignment: 1

Reel/Frame:

011266/0515

Recorded: 10/23/2000

Pages: 8

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

SHIEH, WEN LO

Exec Dt:

08/31/2000

CHUANG, YUNG-CHENG

Exec Dt:

08/31/2000

CHIA-CHIEH, HU

Exec Dt:

08/31/2000

CHEN, HUI-PIN

Exec Dt:

08/31/2000

HUANG, NING

Exec Dt:

08/31/2000

CHANG, TU FENG

Exec Dt:

08/31/2000

CHANG, CHUNG MING

Exec Dt:

08/31/2000

CHIANG, HUA WEN

Exec Dt:

08/31/2000

CHANG, HSUAN JUI

Exec Dt:

08/31/2000

Assignee:

ORIENT SEMICONDUCTOR ELECTRONICS LIMITED

N.E.P.Z.

12-2 NEI HUAN SOUTH ROAD

KAOHSIUNG, TAIWAN

Correspondent:

WEN LO SHIEH

PO BOX 82-144

TAIPEI, TAIWAN

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