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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/28/2002
Application #:
09209345
Filing Dt:
12/11/1998
Publication #:
Pub Dt:
08/16/2001
Inventors:
WILLIAM JOHN NELSON, ALICE TSENG, K.R. LEE, STANLEY LAI
Title:
LEADED SEMICONDUCTOR DEVICE PACKAGE FOR USE IN NONSOLDERING ASSEMBLING
Assignment: 1
Reel/Frame:
009675/0614Recorded: 12/11/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/01/1998
Exec Dt:
11/30/1998
Exec Dt:
12/01/1998
Exec Dt:
11/27/1998
Assignee:
233, PAO CHIAO ROAD
HSIN TIEN, TAIPEI, TAIWAN R.O.C
Correspondent:
VOLPE AND KOENIG, P.C.
GERALD B. HALT, JR., ESQ.
400 ONE PENN CENTER
1617 JOHN F. KENNEDY BLVD.
PHILADELPHIA, PA 19103
Assignment: 2
Reel/Frame:
010179/0635Recorded: 12/11/1998Pages: 2
Conveyance:
(ASSIGNMENT OF ASSIGNOR'S INTEREST) RE-RECORD TO CORRECT THE NUMBER OF MICROFILM PAGES FROM 3 TO 2 AT REEL 9675, FRAME 0614.
Assignors:
Exec Dt:
12/01/1998
Exec Dt:
11/30/1998
Exec Dt:
12/01/1998
Exec Dt:
11/27/1998
Assignee:
233, PAO CHIAO ROAD,
HSIN TIEN, TAIPEI, TAIWAN R.O.C
Correspondent:
VOLPE AND KOENIG, P.C.
GERALD B. HALT, JR.
1617 JOHN F KENNEDY BLVD.
400 ONE PENN CENTER
PHILADELPHIA PA 19103

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