Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/28/2002
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Application #:
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09840439
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Filing Dt:
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04/23/2001
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Publication #:
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Pub Dt:
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11/01/2001
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Inventor:
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Peter R. Ewer
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Title:
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CHIP SCALE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7002-D LITTLE RIVER TPKE |
| ANNANDALE, VIRGINIA 22003 |
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| SEONG-JUN PARK |
| 8133 LEESBURG PIKE STE310 |
| VIENNA, VA 22182 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10TH FLOOR, GOLDEN TOWER |
| 511, SAMSUNG-RO, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF 135-090 |
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| HC PARK & ASSOCIATES, PLC |
| 1894 PRESTON WHITE DR. |
| RESTON, VA 20191 |
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