Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/28/2002
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Application #:
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09624065
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Filing Dt:
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07/24/2000
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Inventor:
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Chien-Ping Huang
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE WITH EXPOSED DIE PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC.3, DA FONG ROAD |
| TANTZU R.O.C., TAIWAN |
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| EDWARDS & ANSGELL, LLP |
| PETER F. CORLESS |
| INTELLECTUAL PROPERTY GROUP |
| 130 WATER STREET |
| BOSTON, MA 02109 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD |
| TANTZU, TAIWAN R.O.C |
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| DIKE, BRONSTEIN, ROBERTS & CUSHMAN |
| STEVEN M. JENSEN |
| EDWARDS & ANGELL, LLP |
| P.O. BOX 9169 |
| BOSTON, MA 02209 |
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