Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/09/2002
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Application #:
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09618672
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Filing Dt:
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07/18/2000
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Inventors:
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Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Mei Sheng Zhou, Sudipto Ranendra Roy, Yakub Aliyu et al
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Title:
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METHOD OF APPLICATION OF COPPER SOLUTION IN FLIP-CHIP, COB , AND MICROMETAL BONDING
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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60 WOODLANDS INDUSTRIAL PARK D-STREET 2 |
SINGAPORE, SINGAPORE 73840 |
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GEORGE O. SAILE |
20 MCINTOSH DRIVE |
POUGHKEEPSIE, NY 12603 |
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