Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/09/2002
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Application #:
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09632903
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Filing Dt:
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08/04/2000
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Inventors:
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Byung Soo Kim, Chang Hun Lee
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Title:
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METHOD OF FORMING SOLDER BUMPS WITH REDUCED UNDERCUTTING OF UNDER BUMP METALLURGY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416, MAETAN-DONG, PALDAL-GU |
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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SAMUELS, GAUTHIER & STEVENS LLP |
ANTHONY P. ONELLO, JR. |
225 FRANKLIN STREET, SUITE 3300 |
BOSTON, MA 02110 |
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