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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/23/2002
Application #:
09443832
Filing Dt:
11/19/1999
Inventors:
YEZDI DORDI, MICHAEL SUGARMAN
Title:
PROCESS SEQUENCE FOR IMPROVED SEED LAYER PRODUCTIVITY AND ACHIEVING 3MM EDGE EXCLUSION FOR A COPPER METALIZATION PROCESS ON SEMICONDUCTOR WAFER
Assignment: 1
Reel/Frame:
010718/0904Recorded: 03/03/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/13/2000
Exec Dt:
01/13/2000
Assignee:
LEGAL AFFAIRS DEPARTMENT
3050 BOWERS AVENUE M/S #2061
SANTA CLARA, CALIFORNIA 95054
Correspondent:
APPLIED MATERIALS, INC.
ROBERT W. MULCAHY
LEGAL AFFAIRS DEPT.
3050 BOWERS AVE. M/S 2061
SANTA CLARA, CA 95054

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