Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/23/2002
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Application #:
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09650703
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Filing Dt:
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08/29/2000
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Inventors:
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Michio Nakajima, Maki Tokuhiro, Hidenori Saito, Saiko Yoshihashi
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Title:
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LAYER INSULATING FILM FOR MULTILAYER INTERCONNECTION, RESIN USED THEREFOR AND PROCESS FOR PRODUCING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SHINAGAWA-KU |
| 5-8, HIGASHISHINAGAWA-2-CHOME |
| TOKYO, JAPAN |
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| SMITH, GAMBRELL ET AL |
| 1850 M STREET NW (SUITE 800) |
| WASHINGTON, D.C. 20036 |
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