Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/06/2002
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Application #:
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09681555
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Filing Dt:
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04/27/2001
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Inventors:
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Richard Joseph Saia, Robert John Wojnarowski, Stanton Earl Weaver JR. et al
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Title:
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HIGH DENSITY INTERCONNECT MULTICHIP MODULE STACK AND FABRICATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE RIVER ROAD |
| SCHENECTADY, NEW YORK 12345 |
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| GENERAL ELECTRIC COMPANY |
| ANN M. AGOSTI |
| BLDG K-1, SALAMONE, PO BOX 8 |
| ONE RESEARCH CIRCLE |
| SCHENECTADY, NY 12301 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 2251 MAXWELL AVE SE |
| 377 ABW/JAN |
| KIRTLAND AFB, NEW MEXICO 87117-5773 |
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| JAMES M. SKORICH |
| 377 ABW/JAN |
| 2251 MAXWELL AVE. SE |
| KIRTLAND AFB, NM 87117-5773 |
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