Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/13/2002
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Application #:
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09183980
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Filing Dt:
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10/31/1998
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Inventors:
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GONZALO AMADOR, GREGORY BARTON HOTCHKISS, KATHERINE G. HEINEN
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Title:
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WAFER-SCALE ASSEMBLY OF CHIP-SIZE PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 655474 M/S 3999 |
| DALLAS, TEXAS 75265 |
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| TEXAS INSTRUMENTS INCORPORATED |
| GARY C. HONEYCUTT |
| P.O. BOX 655474, MS 39999 |
| DALLAS, TEXAS 75265 |
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