Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/13/2002
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Application #:
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09590515
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Filing Dt:
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06/09/2000
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Inventors:
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Hiroyuki Tsukui, Chikara Yamashita, Tetsuya Tao
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Title:
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method of forming solder bumps on a semiconductor device using bump transfer plate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| SCULLY, SCOTT, MURPHY & PRESSER |
| PAUL J. ESATTO, JR. |
| 400 GARDEN CITY PLAZA |
| GARDEN CITY, NY 11530 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA 211-8668, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037 |
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