Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/27/2002
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Application #:
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09661376
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Filing Dt:
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09/13/2000
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Inventors:
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Xingsheng Liu, Guo-Quan Lu
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Title:
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LOW-COST 3D FLIP-CHIP PACKAGING TECHNOLOGY FOR INTEGRATED POWER ELECTRONICS MODULES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MCGUIRE WOODS LLP |
| MICHAEL E. WHITHAM, ESQ. |
| 1750 TYSONS BOULEVARD |
| MCLEAN, VA 22102 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUITE 1625 |
| 1872 PRATT DRIVE |
| BLACKSBURG, VIRGINIA |
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| MCGUIRE WOODS LLP |
| MICHAEL E. WHITHAM, ESQ. |
| 1750 TYSONS BOULEVARD |
| MCLEAN, VIRGINIA 22102 |
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