Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/03/2002
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Application #:
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09677491
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Filing Dt:
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10/02/2000
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Inventors:
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Chia-Chung Wang, Chung-Tao Chang, Kuo-Chuan Chen
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Title:
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METHOD FOR FORMING SOLDER BUMPS FOR FLIP-CHIP BONDING BY USING PERPENDICULARLY LAID MASKING STRIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195 SEC.4, CHUNG HSING ROAD |
| CHUTUNG HSINCH 310, TAIWAN R.O.C |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 W. LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MICHIGAN 48302 |
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