Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09532974
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Filing Dt:
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03/22/2000
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Inventor:
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Masayuki Tobita
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Title:
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HEAT CONDUCTIVE RESIN SUBSTRATE AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8-16, NIHONONBASHI-HONCHO 4-CHOME |
| CHUO-KU, TOKYO, JAPAN |
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| MCGLEW AND TUTTLE, P.C. |
| JOHN JAMES MCGLEW |
| SCARBOROUGH STATION |
| SCARBOROUGH, NEW YORK 10510-0827 |
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