Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09384725
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Filing Dt:
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08/27/1999
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Inventors:
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YOSHIHIRO HARA, TETSUO SUZUKI, SATORU TAKADA, HIDETOSHI INOUE
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Title:
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METHOD FOR RECLAIMING WAFER SUBSTRATE AND POLISHING SOLUTION COMPOSITIONS THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-18, WAKINOHAMA-CHO 1-CHOME, CHUO-KU |
| KOBE-SHI, HYOGO 651-0072, JAPAN |
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| 31031 HUNTWOOD AV. |
| HAYWARD, CALIFORNIA 94544 |
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| OBLON, SPIVAK, MCCLELLAND ET AL |
| CORWIN P. UMBACH |
| 1755 JEFFERSON DAVIS HIGHWAY |
| ATTORNEYS AT LAW, FOURTH FLOOR |
| ARLINGTON, VA 22202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10, WAKINOHAMA-CHO 2-CHOME |
| CHUO-KU, KOBE-SHI |
| HYOGO, JAPAN 651-8585 |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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