Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09858445
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Filing Dt:
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05/17/2001
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Inventors:
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Jeong Min Kweon, Soon Sik Kim, Kyeong Ho Chang, Kyung Rok Lee
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Title:
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INSULATING ADHESIVE TAPE FOR A SEMICONDUCTOR CHIP PACKAGE HAVING A COPPER LEAD FRAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, JOONGSAN-DONG, KYONGSAN-SI |
| KYONGSANGBUK-DO, KOREA, REPUBLIC OF |
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| HARRISON & EGBERT |
| JOHN S. EGBERT |
| 412 MAIN STREET, 7TH FLOOR |
| HOUSTON, TEXAS 77002 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 820-6, DONGHANG-RI YANGSUNGMYUN |
| AHNSUNG-SI KYUNGGI-DO, KOREA, REPUBLIC OF |
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| HARRISON & EGBERT |
| JOHN S. EGBERT |
| 412 MAIN STREET, 7TH FLOOR |
| HOUSTON, TX 77002 |
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