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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/24/2002
Application #:
09672379
Filing Dt:
09/28/2000
Inventors:
Chan Seung Hwang, Seung Ouk Jung
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING REDISTRIBUTION PATTERNS WITH A CONCAVE PATTERN IN A BUMP PAD AREA
Assignment: 1
Reel/Frame:
011161/0739Recorded: 09/28/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/10/2000
Exec Dt:
03/10/2000
Assignee:
SUWON-CITY
416, MAETAN-DONG PALDAL-KU
KYUNGKI-DO, KOREA, REPUBLIC OF
Correspondent:
SKJERVEN MORRILL MACPHERSON LLP
DAVID W. HEID
25 METRO DRIVE, SUITE 700
SAN JOSE, CA 95110

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