Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/12/2002
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Application #:
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09693255
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Filing Dt:
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10/20/2000
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Inventors:
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Ghassem Azdasht, Elke Zakel, Herbert Reichl
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Title:
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METHOD FOR BONDING A FLEXIBLE SUBSTRATE TO A CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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REINICKESTR. 8 |
FALKENSEE, GERMANY D-14612 |
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AM SCHLANGENHORST 15-17 |
NAUEN, GERMANY D-14641 |
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DAVID LEASON |
P.O. BOX 5257 |
NEW YORK, NY 10150-5257 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR AND THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 018490 FRAME 0902. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNOR ASSIGNS TO ASSIGNEES A FIFTY PERCENT (50%) UNDIVIDED INTEREST EACH.
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REINICKESTR. 8 |
FALKENSEE, GERMANY D-14612 |
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AM SCHLANGENHORST 15-17 |
NAUEN, GERMANY D-14641 |
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DAVID LEASON |
P.O. BOX 5257 |
NEW YORK, NY 10150-5257 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AM SCHLANGENHORST 15-17 |
D-14641 NAUEN, GERMANY |
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CECELIA M. PERRY |
MCGLEW AND TUTTLE, P.C. |
SCARBOROUGH STATION |
SCARBOROUGH, NY 10510-9227 |
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