Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/12/2002
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Application #:
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09530466
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Filing Dt:
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04/28/2000
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Inventors:
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EMIKO IGAKI, MASAKAZU TANAHASHI, TAKESHI SUZUKI
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Title:
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CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571 |
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| RATNER & PRESTIA |
| ALLAN RATNER |
| SUITE 301, ONE WESTLAKES, BERWYN |
| PO BOX 980 |
| VALLEY FORGE, PA 19482-0980 |
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